Speedier downloads and app launchesīy leveraging 5G connectivity, AI-enabled mobile applications are unlocking new user experiences that are richer and more immersive than ever before. Can technology deliver the mobile experiences that consumers want? You bet, and here’s how. With higher bandwidth, lower latency and greater power efficiency, new 176-layer 3D NAND helps smartphone designers produce a more responsive mobile experience with true multitasking across apps, all powered on a single battery charge. Micron’s 176-layer UFS 3.1 product for mobile Announced earlier, 176-layer NAND technology is the world’s most technologically advanced flash memory with industry-leading density. In addition, the updated uMCP5 product, a UFS-based multichip package with low-power DDR5 (LPDDR5) DRAM, is now ready for qualification. Micron continues to lead in memory innovation for high-end and flagship phones and today has announced the world’s first 176-layer mobile UFS 3.1 product shipping in volume.
#Plash mobile full#
We were first to mass production in LPDDR5 and first to market with uMCP5 technology for 5G, and we continue to enable OEMs to take full advantage of 5G download speeds of 1 Gbps or faster to unlock the power in their advanced processing engines. Micron’s mobile memory and storage leadership makes it possible to unleash the full potential of 5G experiences. We need a holistic approach where higher memory bandwidth and capacity combine with lower latency and lower power. We can only begin to fathom the new user experiences that this torrent of 5G innovation will bring.īut a new way of thinking is required to converge mobile, 5G and artificial intelligence (AI) technologies. A wave of innovation is already starting to hit our shores.
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